Water-soluble gold anti-tarnish agent AU-20 was developed to protect various gold-plated electronic parts from corrosive gas. As electronic parts have become smaller and high-density integration has advanced, it has become more important to enhance performance reliability. Especially at contact points, where reliability is vital, gold plating is applied. Although gold is chemically stable with low electrical resistance and it has excellent corrosion resistance even in corrosive environments, gold plating layer is usually thin due to its high cost. This can result in pinholes forming easily, which can lower performance due to corrosion caused by corrosive gas entering through the pinholes. [Features] - Great corrosion resistance with only a small increase in contact resistance. → Successfully passes various environmental tests, such as heat resistance, anti-salt spray, anti-sulfuric acid gas, anti-hydrogen sulfide gas, with a minimum increment of contact resistance after testing. → AU-20 reacts with nickel surfaces as well as copper alloys to protect them from corrosive environments. - Solderability is not affected - Maintains necessary lubricity * For details, please download our catalogues or contact us.